As of the date of this document, TopSolid incorporates the following software components:

·        PARASOLID of Siemens PLM Software, 13736 Riverport Drive, Maryland Heights, MO 63043, USA

·        MachineWorks technology of MachineWorks Ltd., 69 Clarkehouse Road, Sheffield S10 2LH, United Kingdom

·        REDSDK of RedWay3D SAS, 13 rue Raymond Losserand, 75014 Paris, France

·        Cadmould Essential of SIMCON kunststofftechnische Software GmbH, Schumanstr. 18 a, 52146 Würselen, Germany

·        PDFNet of PDFTron Systems, Inc., 3661 West 4th Ave., Suite #4, Vancouver, BC, V6R 1P2, Canada

·        3D InterOp of Spatial Corp., 310 Interlocken Parkway, Ste. 200 Broomfield, CO 80021-3468, USA

·        JT Open Toolkit of Siemens PLM Software, 5800 Granite Parkway Suite 600, Plano, TX 75024, USA

·        CrossCad/Ware of Datakit, 99 rue de Gerland F-69007 Lyon, France

·        Teigha of Open Design Alliance, 10645 N. Tatum Blvd. Suite 200-644, Phoenix, AZ 85028, USA

·        SketchUp of Trimble Navigation Limited, 935 Stewart Drive, Sunnyvale, California 94085, USA

·        Forming Technologies Incorporated, 3370 South Service Road, Burlington, ON, L7N 3M6, Canada

·        VoluMill of Celeritive Technologies Inc., 28248 N. Tatum Blvd. B-1, Suite 148, Cave Creek, AZ 85331, USA. This Product includes software developed by the OpenSSL Project for use in the OpenSSL Toolkit (http://openssl.org/). This Product includes cryptographic software written by Eric Young (eay@crypsoft.com).

·        MeshGems of Spatial Corp., 310 INTERLOCKEN PKWY #200, 80021 BROOMFIELD CO, USA

·        PowerNest of Alma, 15 rue Georges Perec, 38400 Saint Martin d'Hères, France

·        Eureka of Roboris Srl, Via Sterpulino, 1, 56121 Pisa PI, Italy

·        5 axis CAM Package of ModuleWorks GmbH Henricistraße 50 52072 Aachen, Germany

·        Open Image Denoise of Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054-1549, USA

·        FFTS of Anthony M. Blake, University of Waikato, Hamilton 3240, NEW ZEALAND

·        CM2 FEM of Computing Objects, 25 rue du Maréchal Foch, 78000 Versailles, FRANCE

·        LAPACK of Univ. of Tennessee; Univ. of California, Berkeley; Univ. of Colorado Denver; and NAG Ltd. under "Modified BSD" license available at : https://netlib.org/lapack/LICENSE.txt

·        "A Fast and Highly Quality Multilevel Scheme for Partitioning Irregular Graph". Georges Karypis and Vipin Kumar. SIAM Journal on Scientific Computing, Vol. 20, No 1, pp. 359-392, 1999

·        The Apache Software Foundation, 1000 N West Street, Suite 1200, Wilmington, DE  19801, USA

·        Licensed under the Apache License, Version 2.0 (the "License"); you may not use this file except in compliance with the License. You may obtain a copy of the License at http://www.apache.org/licenses/LICENSE-2.0

·        Unless required by applicable law or agreed to in writing, software distributed under the License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied. See the License for the specific language governing permissions and limitations under the License.

·        OpenJDK, 1991 Free Software Foundation, Inc. 59 Temple Place, Suite 330, Boston, MA 02111-1307, USA

·        Adobe Substance SDK, Adobe Inc. This software contains Adobe Substance SDK code developed by Adobe Inc. © 2022 Adobe. All rights reserved.